Operating within our 16,000 square feet manufacturing plant,
our support systems and process layouts have been designed
to enhance speed and efficiency in the manufacturing of "quick
turn" prototypes. Processes are oversized to allow for simultaneous
production of several prototypes as well as large production
runs. All critical areas are set up to proper temperature,
humidity, and cleanliness requirements in accordance to IPC
standards.
The following outlines our general manufacturing standards.
No job is too small or too large.
Panel Sizes: Standard material sheet size 914.4 x
1219.2 (36 x 48 inch) We utilises the best cut from these
sheets to gain best usage.
Max. Panel: Largest production panel 18 x 24 inch
and finished board is 16 x 22 inch. Larger panels up to 24
x 42 available.
Material: 1.6 mm 18 / 18 micron copper standard (unless
otherwise specified) 0.8 , 2.0 , 2.4 , 3.2 A. Types 1. FR4
2. High Tg FR5 3. PTFE 4. Low Loss Glass impregnated Hydrocabon/Ceramics
Material tolerances: 0.8 +/- .1 mm 1.6 +/- .15mm 2.4
+/- .25mm 3.2 +/- .3 mm
Air Gap: .005 inch minimum
Trace width: .005 inch minimum
Smallest Plated Hole: .3 finished
Hole size tolerance: +/- .003 inch
Number of Layers: 20
Number of Track (Traces) between pads: 3
SMT (Surface Mount): 15 Mil Pitch
Annular Ring: Outer layer - pad .005 inch over finished
hole size Inner layer - pad .005 inch over finished hole size
Internal Pad (Anti-Pad) Clearance: .030 inch
Fab (NCR Feature) Tolerance: +/- .010 inch
Finish: 60/40 Tin Lead, Deep Nickel, Deep Gold, Solder
mask over Bare Copper (Hot Air Levelled), Reflowed tin/lead.
Plating: Copper in the Holes: .001" Tin Lead in the
Holes: .0003" Edge Connector Fingers: Nickel .0002" Gold 30
Micro/Inches
Solder Mask: Liquid Photo Imageable Blue, Green, Red
& other colours available on request.
I.D. Colour: White, Black, Yellow & other colours
available on request.
Markings: U.L. Logo, Date Code, and PCBEZE logo as
required.
Electrical Testing: Products tested utilising a fixtured
gridded unit. Full netlist testing is accommodated with fixtureless
multiple flying probe systems.
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